How AI Workloads Are Reshaping Packaging Needs
Eric Lee, CEO of Scientech Corporation, spoke with Bloomberg’s Stephen Engle at SEMICON Taiwan on September 2, 2026, about rising demand for AI-related semiconductor packaging solutions. As an advanced packaging firm, Scientech is positioned to benefit from increased investments in AI infrastructure, Lee noted during the industry event in Taipei. He emphasized that the company is seeing stronger order volumes from clients building AI accelerators and high-performance computing systems.
Lee explained that the surge in AI model training and inference is driving demand for more complex chip integration, particularly through advanced packaging technologies like 2.5D and 3D stacking. These methods allow multiple dies to be connected with high bandwidth and low latency, which is essential for AI chips handling massive data flows. Scientech has expanded its production capacity to meet this shift, investing in new equipment and process development to support heterogeneous integration at scale. The CEO said customer engagement has intensified, with longer-term contracts becoming more common as firms secure supply for multi-year AI roadmaps.
What Challenges Remain in Scaling Advanced Packaging
Despite strong demand, Lee acknowledged ongoing challenges, including supply chain constraints for specialty materials and the need for skilled engineers in precision assembly and testing. He noted that while equipment lead times have improved slightly, coordination across the ecosystem — from wafer foundries to test houses — remains critical. Scientech is working closely with partners to standardize interfaces and improve yield predictability, especially for high-density interconnects used in AI accelerators. Lee stressed that innovation in materials and process control will be key to maintaining competitiveness as packaging complexity grows.
What is driving Scientech’s current business growth? The primary driver is increased demand for advanced packaging solutions from customers developing AI accelerators and high-performance computing systems, which require tighter chip integration and higher interconnect density.
Frequently Asked Questions
How is Scientech responding to rising AI-related demand? The company has expanded production capacity, invested in new process equipment, and strengthened customer engagement through longer-term supply agreements to support multi-year AI infrastructure plans.
What obstacles could affect Scientech’s ability to meet future demand? Challenges include limited availability of specialty packaging materials, the need for specialized engineering talent, and ongoing coordination complexities across the semiconductor supply chain, particularly for high-yield, high-density packaging.